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TSMC
Chiayi (JiaShan) Fab 6 Expansion
Chiayi, Taiwan
Investment
$3.0B
CHIPS Act Funding
None disclosed
Technology Node
CoWoS advanced packaging
Jobs Created
3,000
Project Type
Advanced Packaging
Planned HVM Start
Jan 1, 2025
Actual HVM Start
Not yet in production
Last Updated
5d ago
Timeline
No milestones recorded for this project yet.
History of Changes
No changes detected yet for this project.
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