TSMC
Chiayi (JiaShan) Fab 6 Expansion
Chiayi, Taiwan
Investment
$3.0B
CHIPS Act Funding
None disclosed
Technology Node
CoWoS advanced packaging
Jobs Created
3,000
Project Type
Advanced Packaging
Planned HVM Start
Jan 1, 2027
Actual HVM Start
Not yet in production
Last Updated
Sep 28, 2026
Schedule slippage
No verified schedule baseline yet for this project. We add baselines only once we can cite an official earlier target — nothing is estimated.
Timeline
No milestones recorded for this project yet.
History of Changes
Data correction: The record's Jan 2025 target has passed. Trade press describes TSMC's AP7 advanced-packaging complex at this Chiayi site as targeting equipment move-in for Phase 1 in 2026 and mass production in 2027; investment for this entry is unchanged and unverified.
Sep 28, 2026 · planned_hvm_start changed from "2025-01-01" to "2027-01-01"
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View PricingEvidence
- ScheduleReported
See the evidence
Source links, notes and check dates for every verified fact.
General references
Starting points for this project — not a verification of any figure. See Evidence for what has been checked.