The State of CHIPS Act Funding — Mid-2026 Snapshot

The CHIPS and Science Act earmarked roughly $39 billion in direct funding for semiconductor manufacturing incentives. Based on the awards we're tracking across 30 distinct semiconductor and materials projects, at least $46.1 billion in direct CHIPS Act commitments have been publicly disclosed to date — a figure that includes both finalized awards and preliminary agreements still working through due diligence. Where the money has gone Intel is the single largest recipient by a wide margin. Its combined award across the Ohio One megasite (Fabs 1 and 2) and the Chandler, Arizona campus (Fabs 52 and 62) totals $7.865 billion — before accounting for the separate $10 billion preliminary agreement tied to its now-paused Magdeburg, Germany project, which sits outside the direct US manufacturing incentive pool but was negotiated under the same program logic. TSMC's Arizona buildout — now spanning three phases and a planned expansion to twelve fabs — carries a $6.6 billion award. Micron's combined New York and Idaho memory fab investment brings $6.165 billion. Samsung's Taylor, Texas foundry, across its two announced phases, carries $4.745 billion. Below the top tier, the funding spreads across a long list of second-wave recipients: STMicroelectronics ($2.9B combined across its Crolles and Catania projects), Texas Instruments ($1.61B across four Sherman, Texas fabs), and a cluster of awards in the $1-1.5B range to GlobalFoundries, STMicroelectronics again, and Infineon. The smaller awards tell their own story Below $500 million, the awards increasingly go to advanced packaging and specialty materials — Wolfspeed's silicon carbide facility in Siler City ($750M), SK Hynix's Indiana packaging plant ($458M), and Amkor's Arizona packaging campus ($400M) point to a second wave of CHIPS Act priorities beyond leading-edge logic: securing the packaging and materials supply chain that leading-edge fabs depend on. The smallest award we track, $6.1 million to Rogue Valley Microdevices' Oregon facility, is a reminder that CHIPS funding reaches specialty and MEMS foundries too, not just headline megaprojects. What to watch Not every dollar committed has been disbursed, and not every project receiving an award has broken ground on schedule — several, including Intel's Ohio timeline and Samsung's Taylor ramp, have already seen public delay announcements since their original CHIPS agreements were signed. FabPulse tracks these changes in real time; subscribers can watch any project on this list for alerts the moment its status, funding, or timeline changes. Figures reflect FabPulse's tracked dataset as of September 2026, compiled from public CHIPS for America disclosures and company press releases. Award amounts are frequently revised after initial announcement — always verify against primary sources before relying on a specific figure.