SK Hynix

West Lafayette IN Advanced Packaging Fab

West Lafayette, IN, USA

Under Construction

Investment

$3.9B

CHIPS Act Funding

$458M

Technology Node

HBM packaging

Jobs Created

1,000

Project Type

Advanced Packaging

Planned HVM Start

Jan 1, 2028

Actual HVM Start

Not yet in production

Last Updated

5d ago

Timeline

No milestones recorded for this project yet.

No changes detected yet for this project.

$458M

Direct funding award disclosed by the U.S. Department of Commerce's CHIPS for America program.

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