SK Hynix
West Lafayette IN Advanced Packaging Fab
West Lafayette, IN, USA
Investment
$4.0B
CHIPS Act Funding
$458M
Technology Node
HBM packaging
Jobs Created
1,000
Project Type
Advanced Packaging
Planned HVM Start
Jan 1, 2028
Actual HVM Start
Not yet in production
Last Updated
Sep 28, 2026
Schedule slippage
No verified schedule baseline yet for this project. We add baselines only once we can cite an official earlier target — nothing is estimated.
Timeline
No milestones recorded for this project yet.
History of Changes
Data correction: Purdue University's release of the Aug 27, 2026 groundbreaking describes the project as a $4 billion investment; the record showed $3.87B.
Sep 28, 2026 · investment_usd changed from "3870000000" to "4000000000"
1 earlier change in the full history
Every change to this project, each with its source.
CHIPS Act Funding
$458M
Direct funding award disclosed by the U.S. Department of Commerce's CHIPS for America program.
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View PricingEvidence
- StatusConfirmed
- InvestmentConfirmed
- ScheduleReported
See the evidence
Source links, notes and check dates for every verified fact.
General references
Starting points for this project — not a verification of any figure. See Evidence for what has been checked.