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Intel
Rio Rancho NM Fab 9 Advanced Packaging
Rio Rancho, NM, USA
Investment
$3.5B
CHIPS Act Funding
None disclosed
Technology Node
Foveros
Jobs Created
700
Project Type
Advanced Packaging
Planned HVM Start
Jan 1, 2023
Actual HVM Start
Jan 1, 2023
Last Updated
5d ago
Timeline
No milestones recorded for this project yet.
History of Changes
No changes detected yet for this project.
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