Amkor Technology

Peoria AZ Advanced Packaging Facility

Peoria, AZ, USA

Under Construction

Investment

$2.0B

CHIPS Act Funding

$400M

Technology Node

advanced packaging/test

Jobs Created

2,000

Project Type

Advanced Packaging

Planned HVM Start

Jan 1, 2027

Actual HVM Start

Not yet in production

Last Updated

5d ago

Timeline

No milestones recorded for this project yet.

No changes detected yet for this project.

$400M

Direct funding award disclosed by the U.S. Department of Commerce's CHIPS for America program.

Export this data as CSV, get unlimited project alerts, and access the full API with a Pro subscription.