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Western Digital
Shanghai NAND Assembly & Test
Shanghai, China
Investment
$500M
CHIPS Act Funding
None disclosed
Technology Node
NAND flash assembly/test
Jobs Created
3,000
Project Type
Advanced Packaging
Planned HVM Start
Jan 1, 2022
Actual HVM Start
Jan 1, 2022
Last Updated
5d ago
Timeline
No milestones recorded for this project yet.
History of Changes
No changes detected yet for this project.
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